1.3 to 1.55 $\mu\hbox{m}$ All-Optical Wavelength Conversion for VCSEL-to-VCSEL Inversion and Logic
نویسندگان
چکیده
منابع مشابه
Silicon-integrated short-wavelength hybrid-cavity VCSEL.
We demonstrate a short-wavelength hybrid-cavity vertical-cavity surface-emitting laser (VCSEL) heterogeneously integrated on silicon. A GaAs-based "half-VCSEL" has been attached to a dielectric distributed Bragg reflector (DBR) on a silicon wafer using ultra-thin divinylsiloxane-bis-benzocyclobutene (DVS-BCB) adhesive bonding, thereby creating a cavity with the standing-wave optical field exten...
متن کاملCMOS Circuits for VCSEL - Based Optical
Electrical IO is becoming limited by copper interconnect channel losses that depend on frequency and distance. Package-to-package optical interconnects see negligible frequency-dependent channel losses, but data rates are limited by the intrinsic optical dynamics and electrical parasitics of the optical devices. This thesis presents 90nm CMOS front-end circuits which apply techniques to operate...
متن کاملDesign and analysis of VCSEL based twodimension wavelength converter.
A novel two-dimensional vertical cavity surface emission laser (VCSEL) based wavelength converter is proposed. We developed a twodimensional transmission line laser model (TLLM) to analyze the proposed wavelength converter. This model takes into account Bragg reflectors by using the modified connecting matrix. Therefore, accurate and efficient modeling of the VCSEL structure is achieved. Extinc...
متن کاملVCSEL Proliferation
Since the commercialization of Vertical Cavity Surface Emitting Lasers (VCSELs) in 1996, Finisar’s Advanced Optical Components Division has shipped well over 50 Million VCSELs. The vast majority of these were shipped into the data communications industry, which was essentially the only volume application until 2005. The driver for VCSEL manufacturing might well shift to the increasingly popular...
متن کاملAn MT-Style Optical Package for VCSEL and PIN Arrays
A compact optical package for mounting a VCSEL or PIN array has been developed. Each package couples an array to a fiber ribbon terminated with a commercial MT ferrule. The package is fabricated with beryllium oxide (BeO), allowing efficient removal of the heat produced by the array. The package is quite compact as it is significantly smaller than an MT ferrule. The design simplifies testing an...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: IEEE Photonics Journal
سال: 2012
ISSN: 1943-0655
DOI: 10.1109/jphot.2012.2198803